doc. no : qw0905-la38b-78/8g-pf rev. : a date : 15- may. - 2006 data sheet ligitek electronics co.,ltd. property of ligitek only led array la38b-78/8g-pf pb lead-free parts
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1/5 la38b-78/8g-pfpage part no. package dimensions ligitek electronics co.,ltd. property of ligitek only l8g2040-pf 0.5 typ 25.0min - + 1.0min 2.54typ 3.0 4.0 4.2 5.2 1.5max 3.5 0.5 0.5 typ +- 2.54typ 5.2 4.2 7.0 4.0 4.0 3.0
absolute maximum ratings at ta=25 la38b-78/8g-pf part no note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) forward current peak forward current duty 1/10@10khz operating temperature storage temperature reverse current @5v power dissipation peak wave length pnm material green emitted gap 565 lens green diffused color viewing angle 2 1/2 (deg) spectral halfwidth nm 10 luminous intensity @10ma(mcd) forward voltage @ ma(v) 12 min. 2.1 typ. 30 1.7 min. typ. 30 36 tstg ir t opr -40 ~ +100 10 -40 ~ +85 a i f pd i fp parameter symbol ma ma mw ratings unit ligitek electronics co.,ltd. property of ligitek only 2/5 page 15 50 80 8g part no. la38b-78/8g-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 3/5 part no. la38b-78/8g-pf
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 120 25 time(sec) 150 50 100 preheat 0 60 seconds max 2 /sec max 0 260 temp( c) 5 /sec max 260 c3sec max page 4/5 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only part no. la38b-78/8g-pf
1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. solderability test solder resistance test thermal shock test high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this test is the resistance of the device under tropical for hours. mil-std-202:103b jis c 7021: b-11 test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test low temperature storage test operating life test reliability test: test item this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 description reference standard page 5/5 ligitek electronics co.,ltd. property of ligitek only part no. la38b-78/8g-pf
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